Products

Multi-Configurable Optical Probe for Photonic Device Characterization

• Flexibility and ease of use
  • Field-replaceable fibers optimized for a variety of applications
  • Wafer mapping capability and visual display of key parameters
• Accuracy
  • Patented contact protection design ensures fast, accurate, and repeatable measurements at the wafer and substrate level
  • Minimized electrical parasitics for at-speed testing
• Compatibility
  • Standard FC type fiber-optic connector
  • Compatible with FormFactor probe stations and accessories

Custom configured for your application

• Choice of Series resistance or Termination (signal line to ground)
• Use of High Performance RF Resistors
• Choice of Resistor values available
• Choice of body styles, Infinity, ACP or FPC

Wafer-level electrical measurement of mmW devices and materials up to 1.1 THz

• Low insertion loss
• Low contact resistance
• 140 GHz – 1.1 THz versions
• Probe pitch as narrow as 25 μm
• Lithographically-defined probe tip
• Nickel contacts

• Supports up to 12 VNA ports than can be mapped to four logical ports for calibration
• Extensive guidance, wizards and management features automate calibration setup, measurement, result data conversion and report creation
• LRRM-SOLT, multi-line TRL and second-tier calibration methods enable precision and simple multi-port calibrations
• Automatic load inductance compensation function ensures the most repeatable calibrations
• Easy to use Probe to ISS/CSR matching tool
• Additional remoting methods
• Interface with Velox™ over LAN

• Easily create tasks
• Obtain fast results
• Adapts to the user’s needs and skills level
• Reduces working time
• Saves money!
• Designed to operate with maximum intelligence
• Automates workflows
• Enables autonomous measurements

Robust RF Test on PCB and Ceramic

• Replace costly and inflexible test fixtures with easy-to-use probe tips
• Long lifetime – typically over 1,000,000 contacts
• GS/SG footprint up to 4 GHz and GSG up to 20 GHz
• High-power RF test: up to 30 Watts
• Test at temperatures from -60°C to 200°C

High power, High performance probe

• High power – 66 W at 2.4 GHz and 43 W at 5 GHz
• Extremely low insertion loss of ≤ 0.4 dB (typical) up to 40 GHz
• Excellent contact control and low contact resistance
• High performance on any pad material (Al or Au)
• Longest lifetime – typically one million (1,000,000) touchdowns

Excellent Performance – Longest Lifetime

• Best price per contact – typically over one million (1,000,000) touchdowns
• RF/Microwave signal is shielded and completely air isolated in the probe body
• Excellent performance in vacuum environments and temperatures as low as 4 K, or as high as 300°C
• Highest impedance control with perfectly-symmetrical, MEMS-machined coplanar contact structure
• Probe on any pad material with minimal damage

• Highest accuracy in test results
• Easy setup even for less experienced users
• Minimized coupling losses with minimal trench dimensions
• Exclusive FormFactor-developed automated test methodology
• Wide range of tools for capturing, logging and interpreting data
• Enables hands-free autonomous calibration and re-calibration at multiple temperatures
• Search First Light feature enables automated determination of initial position for optimization
• Once aligned, all calibration functions are automated and performed through SiPh-Tool

• On-wafer power device characterization up to 10,000 V DC / 600 A
• Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
• Prevent thin wafers from curling and breaking
• Accurate Rds(on) measurement at high current
• Accurate UIS measurements at high temperature
• Roll-out stage for full wafer access and easy wafer loading/unloading
• Seamless integration between Velox and analyzers/measurement software
• High-throughput wafer autoloading (standard, thinned, warped, TAIKO)
• Easy on-screen navigation, wafer mapping, and operation of accessories with Velox

Enabling single-contact high-current/high-voltage test

• Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
• Even distribution of high current with innovative multi-fingertip design
• Compatible with Tesla 200/300 mm power device characterization system
• Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
• Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
• Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)

• 16K Video Generator & Analyzer
• Dolby Vision™, HDR 10 and HDR 10+
• validating DP 1.4a & DP 2.0 Link Layer on DP Sinks and Sources
• Power Input +12 Vdc (AC/DC converter included)
• Module Size/Weight TBD for Weight and Size

• Compact sized DisplayPort™ 1.2 compliant Reference Sink
• HBR2 and MST capable Sink and Branch device
• Cerified as the platform for DP 1.2 LL CTS Ext1 tests
• Optional MST Debug panel and AUX Channel Monitor
• Debug and Test Controller GUI enables monitoring and previewing any MST stream
• User programmable EDID and DPCD

•  HDMI 2.1 Test Equipment (FRL)
• Enhanced Gaming Features (VRR, ALLM)
• FEC, Forward Error Correction
• HDCP 2.2 & HDCP 2.3 support  TMDS Support
• Dolby Vision™ Test Tool
• 8K@60 fps Support (12 Gbps/channel)
• eARC Support (end of 2019)
• DSC Support (ESTIMATED 2020)
• UCD Console GUI for debugging
• High level API for easy integreation

• Automated tests for USB-C™ DisplayPort™ Alt Mode
• Electrical Test to verify whole USB-C connector with single cable insert
• Test USB 2.0 and USB 3.0
• 4K@60 support
• Easily set test parameters with provided Software
• Easily run tests from the commandline
• Unigraf’s Test System Interface (TSI) Support
• Third Part Test Management Software
• Support e.g. NI TestStand Support

• UHD / 4K compliant test equipment
• HDMI 2.0 and DP 1.2 input and output in one unit
• DCP Approved HDCP 2.3 CTS Test Tool
• HDCP 1.3 and HDCP 2.3 support
• Sink and source video, audio and configuration parameters
• USB 3.0 connected
• UCD Console GUI for debugging
• High level API for easy integration