Semiconductor Test & Measurement

• Functional temperature range of -263 to +150°C
• Stainless steel tip material for thermal decoupling
• Coaxial cable with TCE matched inner and outer conductors
• Consistent tip geometry even at cryogenic temperatures

High-performance DC Parametric Probe

• Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
• Guarantees fully-guarded measurements to fA and fF levels
• Individual connectors provide force-sense connection for quasi-Kelvin and CV measurements
• Allows probing of different pad materials and sizes
• Fast replacement of worn probes without the need for tools

Multi-contact DC Probe with flat tip needles

• Power bypass inductance: 8 nH
• Standard DCQ probes have flat tip needles available in nickel-plated tungsten or BeCu with diameters of 0.75 mil, 1.0 mil and 1.5 mil.
• Supports collinear and non-standard needle configurations
• Up to 16 DC for standard; maximum of 24 DC for custom
• Ideal for probing the entire circuit for functional test
• DC probes can provide power or slow logic to circuit under test

Tables from simple to highly sensitive

• Designed for use with specific Probe Systems
• Tables to suit all facility requirements and applications
• Stable probing, even in submicron range
• Granite platen ensures rigidity and temperature stability
• Can be combined with the Shield Enclosures

Multi-contact DC Probe with full-radius needles

• Full-radius, nickel-plated tungsten needles
• Power bypass inductance: 16 nH
• Supports collinear and non-standard needle configurations
• Support up to a maximum of 12 ceramic blades DC needles / contacts
• Ideal for probing the entire circuit for functional test
• DC probes can provide power or slow logic to circuit under test

Rugged, deep reach RF probing for modules and circuit boards

• DC-40 GHz bandwidth
• 10 ps rise time
• Low insertion and return loss
• 2 mils of tip-to-tip compliance
• High probing angle and clearance

Perfectly matched to the |Z| Probe®

The CSR family of calibration substrates delivers the highest accuracy available due to the high quality of each substrate. The calibration standards are manufactured using rugged, hard gold, which ensures a long lifetime.

• SlimVue Microscope
  • Combined eye-pieces and CCD camera mount
  • 3x zoom and quick lens exchange
  • Quick lens exchange
  • 1 um optical resolution
  • Minimized scope footprin
• Application Specific Sigma Kits
  • Optical feedback on platen position (gauge)
  • Adaptable to any mmW/sub-THz applications
  • Seamless integration with any mmW modules and tuners
  • Fast mounting and setup change
• THz measurement capability
  • Rock-solid mechanical design
  • Submicron stage accuracy
  • Optical feedback on platen and probe position (gauge)
  • Motorized positioner

Durable multi-contact wafer probe with controlled impedance power bypass technology

• High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
• RF bandwidth to 500 MHz
• Long probe life: > 250,000 contacts
• Beryllium-copper tips for gold pads or tungsten for aluminum pads
• Oscillation-free testing of wide-bandwidth analog circuits
• Use with ACP series probes to provide functional at-speed testing for known-good-die
• Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
• Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)

• Three Probe Technologies
  • nfinity Probe: best for Al (Si)
  • ACP Probe: best for AU (III-Vs)
  • |Z| Probe: robust solution (long lifetime)
• Precise Contact Solution
  •  Precision probe alignment
  • Consistent contact force and overtravel
  • Stable contact performance
• WinCal XE Calibration Software
  • Exclusive 1-, 2-, 3-, and 4-port on-wafer calibration algorithms
  • Automated calibration monitoring
  • Unique measurement & analysis methods

Multiline TRL Substrates for T-Wave Probes

• Substrate material: High-resistivity silicon
• Substrate thickness: 275 µm
• Dielectric constant: 11.8
• Nominal Z₀: 50 Ω

200 mm semi-/ fully-automated production probe system

• Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
• Faster time to data
• Highest Z-axis resolution of any production prober
• Highest Z-axis resolution of any production prober
• Interfaces to all major analysis instrumentation, optics software and testers
• Backside instrumentation, e.g.: Integrating Sphere, Fiber setup, Pressure Module
• Highly accurate light measurement

Long-lasting, rugged RF and microwave on-wafer probes

• Unique Air Coplanar tip design with choice of beryllium copper (BeCu) or tungsten tip material
• DC to 110 GHz models available in single and dual line versions
• Low insertion and return loss with ultra-low-loss ( -L ) versions
• Excellent crosstalk characteristics
• Wide operating temperature -65 ° C to + 200 ° C
• Wide range of pitches available, from 50 to 1250 µm
• Individually supported contacts
• Reduced contact (RC) probe tips for small pads
• BeCu tip provides rugged, repeatable contact on gold pads

• Flexibility
  • Different substrate carriers for wafers up to 200 mm or single dies
  • Probe cards and/or up to eight positioners
  • Use with liquid nitrogen or helium, depending on the target temperature
• Stability
  • Probe positioners placed inside vacuum chamber
  • Short and stable probe arms
  • Solid station frame with built-in vibration-isolation
  • Optional microscope bridge
  • Precise probe positioning
• Ease of Use
  • Joystick controller
  • Manual probe positioners with rotary feed-throughs
  • Front loading capability through load door
  • Comfortable and easy operation

• Flexibility
  • Different substrate carriers for wafers up to 200 mm or single dies
  • Probe cards and/or up to eight positioners
  • Optional thermal chuck (-60°C to 300°C) and pressure regulation
• Stability
  • Probe positioners placed inside vacuum chamber
  • Short and stable probe arms
  • Solid station frame with built-in vibration-isolation
  • Optional microscope bridge
  • Precise probe positioning
• Ease of Use
  • Joystick controller
  • Manual probe positioners with rotary feed-throughs
  • Front loading capability through load door
• High measurement throughput
  • Software control of chuck for fast step-and-repeat testing of the entire wafer
  • Fast step-and-repeat testing of the whole wafer

• Flexibility
  • Different substrate carriers for wafers up to 200 mm or single dies
  • Probe cards and/or up to eight positioners
  • Optional thermal chuck (-60°C to 300°C) and pressure regulation
• Stability
  • Probe positioners placed inside vacuum chamber
  • Short and stable probe arms
  • Solid station frame with built-in vibration-isolation
  • Optional microscope bridge
  • Precise probe positioning
• Ease of Use
  • Joystick controller
  • Manual probe positioners with rotary feed-throughs
  • Front loading capability through load door
  • Comfortable and easy operation
• High measurement throughput
  • Software control of chuck for fast step-and-repeat testing of the entire wafer
  • Fast step-and-repeat testing of the whole wafer