Probe Systems

150 mm modular probe station

• Ideal for a wide range of applications such as RF, mm-Wave and sub-THz characterization, FA, DWC, MEMS, optoelectronic tests and WL
• Re-configurable and upgradable as requirements grow
• Minimizes setup times with no loss in performance or accuracy
• Seamless integration of various measurement instruments

100 mm manual cryogenic probe system

• Specially designed for laboratory environments
• Different substrate carriers for wafers up to 100 mm or single dies
• Probe positioners placed inside vacuum chamber
• Excellent measurement accuracy and repeatability
• Simple microscope operation
• Comfortable and easy operation
• Fast, manual step-and-repeat testing of the whole wafer
• Simultaneous contacting and separation of all probes

• Supports up to 12 VNA ports than can be mapped to four logical ports for calibration
• Extensive guidance, wizards and management features automate calibration setup, measurement, result data conversion and report creation
• LRRM-SOLT, multi-line TRL and second-tier calibration methods enable precision and simple multi-port calibrations
• Automatic load inductance compensation function ensures the most repeatable calibrations
• Easy to use Probe to ISS/CSR matching tool
• Additional remoting methods
• Interface with Velox™ over LAN

• Easily create tasks
• Obtain fast results
• Adapts to the user’s needs and skills level
• Reduces working time
• Saves money!
• Designed to operate with maximum intelligence
• Automates workflows
• Enables autonomous measurements

• Highest accuracy in test results
• Easy setup even for less experienced users
• Minimized coupling losses with minimal trench dimensions
• Exclusive FormFactor-developed automated test methodology
• Wide range of tools for capturing, logging and interpreting data
• Enables hands-free autonomous calibration and re-calibration at multiple temperatures
• Search First Light feature enables automated determination of initial position for optimization
• Once aligned, all calibration functions are automated and performed through SiPh-Tool

• On-wafer power device characterization up to 10,000 V DC / 600 A
• Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
• Prevent thin wafers from curling and breaking
• Accurate Rds(on) measurement at high current
• Accurate UIS measurements at high temperature
• Roll-out stage for full wafer access and easy wafer loading/unloading
• Seamless integration between Velox and analyzers/measurement software
• High-throughput wafer autoloading (standard, thinned, warped, TAIKO)
• Easy on-screen navigation, wafer mapping, and operation of accessories with Velox