Uncategorized

Teledyne Test Tools Milli Ohm Meter offers high-precision low-resistance measurement with advanced drive modes, temperature compensation, and fast sampling.

Key Features:

• 50,000-count high-resolution display
• 3.5″ TFT LCD (320×240)
• 0.05% measurement accuracy
• 1 Amp test current with 0.1 μΩ resolution
• Fast 60 readings per second
• Four-wire measurement method
• Temperature compensation and delayed measurement
• 20-panel memory settings
• Dry circuit testing (T3MIL50X only)
• USB, RS-232C, and EXT I/O interfaces
• Multiple drive modes: DC+, DC-, Pulsed, PWM (T3MIL50X)

PureLine 3 Technology

First automated probe station to achieve -190dB spectral noise*

Plug In and Go

Integrated TestCell Power Management provides fully managed and filtered AC power to the entire system, prober and instruments

Autonomous 24/7 Operation

Up to 4x faster flicker noise thermal testing on 30 μm pads

Reduce Setup Time and Costs
Exclusive low noise site survey, and system verification services

• Quick and easy probe tip navigation
• Maximizes field-of-view
• High magnification
• Shadow-free view of the corresponding features
• Automatically configure and optimize performance
• cTUVus certified and CE
• Compatible with TopHat for perfect shielding
• 24/7 operating, Increased MTBF
• Stops all system motion and warns of unobserved contact

• Comprehensive,
• Turn-key Integrated Measurement System (IMS)
• with Keysight PNA for On-wafer R&D Measurements
• from RF to millimeter wave to Terahertz

Accurate and precise measurement of device parameters up to 3,000 V

• Coaxial and triaxial measurements up to 3,000 V
• High-quality construction with low-noise electrical performance
• Replaceable probe tips in a variety of tip sizes
• Temperature range of -55 to 300ºC
• Triaxial measurement ensures a much better understanding of device leakage in the off state
• Highly reliable, stable and repeatable measurements
• Integrally designed as part of a complete measurement solution

Delivers superior guarding and shielding

• High-quality construction with low-noise electrical performance
• Kelvin version for convenient 4-point measurements
• Replaceable coaxial probe tips, with choice of tip radii, and full electrical guard to the probe tip
• SSMC 50 connectors
• Ultra-low, fA and fF measurements from -65 º C to 150 º C

High-performance DC Parametric Probe

• Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
• Guarantees fully-guarded measurements to fA and fF levels
• Individual connectors provide force-sense connection for quasi-Kelvin and CV measurements
• Allows probing of different pad materials and sizes
• Fast replacement of worn probes without the need for tools

Multi-contact DC Probe with flat tip needles

• Power bypass inductance: 8 nH
• Standard DCQ probes have flat tip needles available in nickel-plated tungsten or BeCu with diameters of 0.75 mil, 1.0 mil and 1.5 mil.
• Supports collinear and non-standard needle configurations
• Up to 16 DC for standard; maximum of 24 DC for custom
• Ideal for probing the entire circuit for functional test
• DC probes can provide power or slow logic to circuit under test

Multi-contact DC Probe with full-radius needles

• Full-radius, nickel-plated tungsten needles
• Power bypass inductance: 16 nH
• Supports collinear and non-standard needle configurations
• Support up to a maximum of 12 ceramic blades DC needles / contacts
• Ideal for probing the entire circuit for functional test
• DC probes can provide power or slow logic to circuit under test

Rugged, deep reach RF probing for modules and circuit boards

• DC-40 GHz bandwidth
• 10 ps rise time
• Low insertion and return loss
• 2 mils of tip-to-tip compliance
• High probing angle and clearance

• SlimVue Microscope
  • Combined eye-pieces and CCD camera mount
  • 3x zoom and quick lens exchange
  • Quick lens exchange
  • 1 um optical resolution
  • Minimized scope footprin
• Application Specific Sigma Kits
  • Optical feedback on platen position (gauge)
  • Adaptable to any mmW/sub-THz applications
  • Seamless integration with any mmW modules and tuners
  • Fast mounting and setup change
• THz measurement capability
  • Rock-solid mechanical design
  • Submicron stage accuracy
  • Optical feedback on platen and probe position (gauge)
  • Motorized positioner

Durable multi-contact wafer probe with controlled impedance power bypass technology

• High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
• RF bandwidth to 500 MHz
• Long probe life: > 250,000 contacts
• Beryllium-copper tips for gold pads or tungsten for aluminum pads
• Oscillation-free testing of wide-bandwidth analog circuits
• Use with ACP series probes to provide functional at-speed testing for known-good-die
• Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
• Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)

• Three Probe Technologies
  • nfinity Probe: best for Al (Si)
  • ACP Probe: best for AU (III-Vs)
  • |Z| Probe: robust solution (long lifetime)
• Precise Contact Solution
  •  Precision probe alignment
  • Consistent contact force and overtravel
  • Stable contact performance
• WinCal XE Calibration Software
  • Exclusive 1-, 2-, 3-, and 4-port on-wafer calibration algorithms
  • Automated calibration monitoring
  • Unique measurement & analysis methods

200 mm semi-/ fully-automated production probe system

• Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
• Faster time to data
• Highest Z-axis resolution of any production prober
• Highest Z-axis resolution of any production prober
• Interfaces to all major analysis instrumentation, optics software and testers
• Backside instrumentation, e.g.: Integrating Sphere, Fiber setup, Pressure Module
• Highly accurate light measurement

Long-lasting, rugged RF and microwave on-wafer probes

• Unique Air Coplanar tip design with choice of beryllium copper (BeCu) or tungsten tip material
• DC to 110 GHz models available in single and dual line versions
• Low insertion and return loss with ultra-low-loss ( -L ) versions
• Excellent crosstalk characteristics
• Wide operating temperature -65 ° C to + 200 ° C
• Wide range of pitches available, from 50 to 1250 µm
• Individually supported contacts
• Reduced contact (RC) probe tips for small pads
• BeCu tip provides rugged, repeatable contact on gold pads

• Flexibility
  • Different substrate carriers for wafers up to 200 mm or single dies
  • Probe cards and/or up to eight positioners
  • Use with liquid nitrogen or helium, depending on the target temperature
• Stability
  • Probe positioners placed inside vacuum chamber
  • Short and stable probe arms
  • Solid station frame with built-in vibration-isolation
  • Optional microscope bridge
  • Precise probe positioning
• Ease of Use
  • Joystick controller
  • Manual probe positioners with rotary feed-throughs
  • Front loading capability through load door
  • Comfortable and easy operation