FormFactor Beaverton Inc

Showing 49–64 of 69 results


    • Lithographic thin-film construction
    • Excellent crosstalk characteristics
    • Non-oxidizing nickel alloy tips
    • Innovative force delivery mechanism
    • 40GHz, 50GHz, 67GHz, 110GHz and 145GHz connectors available
    • GSG, SG, GS, GSGSG, GSSG, SGS configurations
    • 50 to 250 µm pitches (other pitches available on request)
    • High current version (2 A) available

     

  • A configurable fine-pitch multi-contact RF/mmW probe for mixed-signal probing up to 110 GHz

    • Customizable configuration up to 25 contacts: RF, Eye-Pass power, ground, logic
    • Lithographically-defined tips allow automated over temperature measurement on pads as small as 30 µm x 50 µm
    • Low and repeatable contact resistance on aluminum pads (< 0.05 Ω) ensures accurate results
    • Durable probe structure ensures more than 250,000 contacts
    • Able to measure from -40°C to +125°C without compromising performance or accuracy of specifications

     

  • Repeatable measurements up to 500 GHz with improved crosstalk performance

    • Probe loss is 3 dB typical between 140 and 200 GHz, S11/S22 15 dB typical
    • Reduced unwanted couplings and transmission modes
    • Able to shrink pad geometries to 25 x 35 µm (best case)
    • Typical contact resistance < 0.05 Ω on Al, < 0.02 Ω on Au
    • WR15, WR12, WR10, WR8, WR6, WR4, WR3, and WR2 bands available.

     

     

  • Next-generation, high-frequency performance with advanced features

    • Continues the Infinity family’s Industry leading electrical performance
    • High temperature capability (175° C +) for automotive device characterization and other applications
    • Better tip visibility for enhanced placement accuracy and repeatability
    • Improved tip life/durability with solid rhodium contacts
    • New tip architecture enables support for narrower pitches (e.g. 25um)
    • Advanced mechanical design combined with small contacts enables probing on smaller pads/pitches and improves durability and robustness

     

  • Test Up to 16 RF Signals with One Probe

    • Ideal for multiport RF/Microwave and high-speed digital signal testing
    • Mix DC and RF/Microwave signals on one probe
    • Long lifetime – typically over one million (1,000,000) touchdowns
    • Excellent performance in temperatures ranging from 10 K to 200°C
    • Probe on any pad material with no damage

     

  • Cost-effective, versatile probe card solution

    • Accommodates a combination of up to four Cascade Microtech probes
    • Configurable for mixed-signal RF/mmW testing
    • Quick and easy repairs to be performed in the field, by simply replacing individual probes
    • Adaptable to new device layouts by exchanging individual probes

     

  • Multicontact Probe for RFIC Engineering Test

    • Up to 12 contacts; any contact can be DC, Power, Logic to 500 MHz,or RF to 20 GHz
    • Online design configuration tool helps you to specify your probe in minutes
    • All designs are fully quadrant compatible
    • Full solution includes probes, calibration substrates, stations, accessories and software
    • Scalable architecture for future needs

     

  • HF and DC Signals on One Cost-Effective ProbeWedge

    • Flexibility
      • The ProbeWedge family is compatible with your existing Cascade Microtech’s probing systems
      • Plug and play design provides easy handling and strain relief
      • Ideal probe solution for wafer-level reliability, multi-site tests and DC biasing
    • Cost effectiveness
      • Alternative to inflexible probe cards, ideal for changing demands in R&D
      • All cables can be re-used and additional single cables can be ordered
      • Probe blades can be repaired individually
    • Accuracy
      • Kelvin ProbeWedge is ideal for low-resistance measurements
      • Fully-guarded microstrip blades for low-current measurements down to fA range

     

     

  • A configurable fine-pitch multi-contact RF/mmW probe for mixed-signal probing up to 110 GHz

    • Customizable configuration up to 25 contacts: RF, Eye-Pass power, ground, logic
    • Lithographically-defined tips allow automated over temperature measurement on pads as small as 30 µm x 50 µm
    • Low and repeatable contact resistance on aluminum pads (< 0.05 Ω) ensures accurate results
    • Durable probe structure ensures more than 250,000 contacts
    • Able to measure from -40°C to +125°C without compromising performance or accuracy of specifications

     

  • 100 mm manual cryogenic probe system

    • Specially designed for laboratory environments
    • Different substrate carriers for wafers up to 100 mm or single dies
    • Probe positioners placed inside vacuum chamber
    • Excellent measurement accuracy and repeatability
    • Simple microscope operation
    • Comfortable and easy operation
    • Fast, manual step-and-repeat testing of the whole wafer
    • Simultaneous contacting and separation of all probes

     

  • Multi-Configurable Optical Probe for Photonic Device Characterization

    • Flexibility and ease of use
      • Field-replaceable fibers optimized for a variety of applications
      • Wafer mapping capability and visual display of key parameters
    • Accuracy
      • Patented contact protection design ensures fast, accurate, and repeatable measurements at the wafer and substrate level
      • Minimized electrical parasitics for at-speed testing
    • Compatibility
      • Standard FC type fiber-optic connector
      • Compatible with FormFactor probe stations and accessories

     

     

     

  • Custom configured for your application

    • Choice of Series resistance or Termination (signal line to ground)
    • Use of High Performance RF Resistors
    • Choice of Resistor values available
    • Choice of body styles, Infinity, ACP or FPC

     

  • Wafer-level electrical measurement of mmW devices and materials up to 1.1 THz

    • Low insertion loss
    • Low contact resistance
    • 140 GHz – 1.1 THz versions
    • Probe pitch as narrow as 25 μm
    • Lithographically-defined probe tip
    • Nickel contacts

     

    • Supports up to 12 VNA ports than can be mapped to four logical ports for calibration
    • Extensive guidance, wizards and management features automate calibration setup, measurement, result data conversion and report creation
    • LRRM-SOLT, multi-line TRL and second-tier calibration methods enable precision and simple multi-port calibrations
    • Automatic load inductance compensation function ensures the most repeatable calibrations
    • Easy to use Probe to ISS/CSR matching tool
    • Additional remoting methods
    • Interface with Velox™ over LAN

     

    • Easily create tasks
    • Obtain fast results
    • Adapts to the user’s needs and skills level
    • Reduces working time
    • Saves money!
    • Designed to operate with maximum intelligence
    • Automates workflows
    • Enables autonomous measurements

     

  • Robust RF Test on PCB and Ceramic

    • Replace costly and inflexible test fixtures with easy-to-use probe tips
    • Long lifetime – typically over 1,000,000 contacts
    • GS/SG footprint up to 4 GHz and GSG up to 20 GHz
    • High-power RF test: up to 30 Watts
    • Test at temperatures from -60°C to 200°C

     


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