Description
High Current Probe
FormFactor Beaverton High-Current ProbeHCP PROBEFormFactor Beaverton’s High-Current Probe (HCP) reduces probe and/or device destruction at high currents. It supports 10 A DC and up to 100 A of pulsed current. By design, the probe tip minimizes contact resistance at the wafer-to-probe interface to prevent device heating at the tip. The innovative multi-finger probe tip design distributes current evenly over multiple contact points and is joined by a single heat sink that pulls pull heat from the probe tip. FormFactor Beaverton High-Current Probe
HCP Probe Holder
contact points and is joined by a single heat sink that pulls pull heat from the probe tip.High Current Probe OverviewDesigned specifically for testing power devices on wafer, the HCP probe reduces probe and device destruction at high currents by minimizing contact resistance at the wafer-to-probe interface to prevent device heating at the tip. The innovative multi-finger design distributes the current over multiple contact points at the tip and is joined by a single heatsink which pulls heat from the probe tip. FormFactor Beaverton High-Current Probe High Current Probe Key Features
FormFactor Beaverton High Current Probe |