Current Probes

The TESLA300 Advanced On-Wafer Power Semiconductor Probe System is an integrated high-power test solution that enables the collection of accurate high-voltage and high-current measurement data up to 3 kV (triaxial) / 10 kV (coaxial) and 200 A (standard) / 600 A (high current), with complete operator safety.

• Vector Network Analyzer (option up to 26.5GHz)
• WinCal XE calibration software
• Uses best measurement practices for optimized measurements
• Known measurement accuracy traced back to independent standards
• Supported by the measurement experts to make you successful
• Best in class RF performance
• Small benchtop footprint
• Industry standard calibration techniques
• Extended 2 Year warranty on FormFactor products for educational customers

• Re-configurable for DC, RF, mmW, FA, WLR and more
• table and repeatable measurements over a wide thermal range
• Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
• Minimize AC and spectral noise
• Manual 3-axis stage with ergonomic controls
• Fast, accurate “hands on” wafer positioning
• Quick, safe, and comfortable wafer access

• Comfortable and ergonomic operation
• Thermal range ambient to +300°C
• RF/microwave device characterization, FA and design debug
• Seamless integration between Velox and analyzers/measurement software
• Complete solutions using probe positioners and probe cards
• Achieve unsurpassed RF/mmW measurement and calibration accuracy with integrated RF tools and WinCal
• Shortest signal path test integration for accurate, thermally stable, and low-error data collection
• Powerful automation tools, reduce total test time on wafers, singulated dies, and modules
• Faster time to first data for standard and “hard to test” devices such as thin wafer, small pad and high power
• Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact

• On-wafer power device characterization up to 10,000 V DC / 600 A
• Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
• Prevent thin wafers from curling and breaking
• Accurate Rds(on) measurement at high current
• Accurate UIS measurements at high temperature
• Roll-out stage for full wafer access and easy wafer loading/unloading
• Seamless integration between Velox and analyzers/measurement software
• High-throughput wafer autoloading (standard, thinned, warped, TAIKO)
• Easy on-screen navigation, wafer mapping, and operation of accessories with Velox

Enabling single-contact high-current/high-voltage test

• Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
• Even distribution of high current with innovative multi-fingertip design
• Compatible with Tesla 200/300 mm power device characterization system
• Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
• Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
• Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)

Multi-range 1000A Voltage Output Sensor for Capturing Waveforms with DMMS, Memory HiCorders and other data acquisition equipment

Multi-range 500A Voltage Output Sensor for Capturing Waveforms with DMMS, Memory HiCorders and other data acquisition equipment.

Power supply for the Clamp on AC/DC sensors unit

DC to 20 kHz/200A AC/DC Clamp On Current Probe

DC to 10 kHz/100A AC/DC Clamp On Current Probe

Power Supply Unit for Outputting Current Probe Signals to Memory HiCorders and Oscilloscopes

Power Supply Unit for Outputting Current Probe Signals to Memory HiCorders and Oscilloscopes

Wideband DC to 2 MHz/500A AC/DC Current Probe for Oscilloscopes

Wide band DC to 10 MHz/150A AC/DC Current Probe for Oscilloscopes