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    • Easily create tasks
    • Obtain fast results
    • Adapts to the user’s needs and skills level
    • Reduces working time
    • Saves money!
    • Designed to operate with maximum intelligence
    • Automates workflows
    • Enables autonomous measurements

     

  • Robust RF Test on PCB and Ceramic

    • Replace costly and inflexible test fixtures with easy-to-use probe tips
    • Long lifetime – typically over 1,000,000 contacts
    • GS/SG footprint up to 4 GHz and GSG up to 20 GHz
    • High-power RF test: up to 30 Watts
    • Test at temperatures from -60°C to 200°C

     

  • High power, High performance probe

    • High power – 66 W at 2.4 GHz and 43 W at 5 GHz
    • Extremely low insertion loss of ≤ 0.4 dB (typical) up to 40 GHz
    • Excellent contact control and low contact resistance
    • High performance on any pad material (Al or Au)
    • Longest lifetime – typically one million (1,000,000) touchdowns

     

  • Excellent Performance – Longest Lifetime

    • Best price per contact – typically over one million (1,000,000) touchdowns
    • RF/Microwave signal is shielded and completely air isolated in the probe body
    • Excellent performance in vacuum environments and temperatures as low as 4 K, or as high as 300°C
    • Highest impedance control with perfectly-symmetrical, MEMS-machined coplanar contact structure
    • Probe on any pad material with minimal damage

     

    • Highest accuracy in test results
    • Easy setup even for less experienced users
    • Minimized coupling losses with minimal trench dimensions
    • Exclusive FormFactor-developed automated test methodology
    • Wide range of tools for capturing, logging and interpreting data
    • Enables hands-free autonomous calibration and re-calibration at multiple temperatures
    • Search First Light feature enables automated determination of initial position for optimization
    • Once aligned, all calibration functions are automated and performed through SiPh-Tool

     

  • Key Performance Capabilities:

    • Slew rates up to 60 V/µsec.
    • Up to 240A DC at +50VDC or –50VDC (4301-240 configuration).
    • Can provide pulses of up to 800 amps at voltages of up to ±100V (4301-240 configuration).
    • Adjustable compensation allows the system to maintain a 50V/2 µsec rise-time over a wide range of current outputs.

     

  • Key Performance Capabilities:

    • Bandwidth: DC to 50 kHz
    • Voltage: 0 to 250 VRMS; 0 to 350 VDC
    • Current: 100 to 500 ARMS
    • Distortion: 0.1%
    • Power: 4 kW to 20 kW*Power levels up to 5X rated power when driving reactive loads
    • High power efficiency and density

    *Models available with output from 4 kW to 20 kW (capable of up to 125 kVA).

     

  • Key Performance Capabilities:

    • 4-Quadrant – Can source and sink current
    • ±80V – DC supply for 12V to 48V systems; meets 80V surge requirements
    • 300 kHz Sine – DC ripple tests for all major standards
    • 3µs Rise Time – Exceeds surge and dropout slew rate requirements
    • 3mΩ DC Source Impedance – Out-performs ISO 7637-2 requirements
    • Supports ground reference and supply offset testing required for ISO 16750-2 Sect. 4.8 and other similar standards

     

  • Key Performance Capabilities:

    • Up to 900 watts RMS power output (7136 model)
    • Small signal response up to 400 kHz
    • User-adjustable precision DC offset
    • User-adjustable current limit: 1A to 25A
    • 4-quadrant operation
    • AC/DC coupled

     

  • Key Performance Capabilities:

    • Up to 900 watts RMS power output (7136 model)
    • Small signal response up to 400 kHz
    • User-adjustable precision DC offset
    • User-adjustable current limit: 1A to 25A
    • 4-quadrant operation
    • AC/DC coupled

     

    • On-wafer power device characterization up to 10,000 V DC / 600 A
    • Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
    • Prevent thin wafers from curling and breaking
    • Accurate Rds(on) measurement at high current
    • Accurate UIS measurements at high temperature
    • Roll-out stage for full wafer access and easy wafer loading/unloading
    • Seamless integration between Velox and analyzers/measurement software
    • High-throughput wafer autoloading (standard, thinned, warped, TAIKO)
    • Easy on-screen navigation, wafer mapping, and operation of accessories with Velox
  • Enabling single-contact high-current/high-voltage test

    • Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
    • Even distribution of high current with innovative multi-fingertip design
    • Compatible with Tesla 200/300 mm power device characterization system
    • Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
    • Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
    • Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)

     

  • High‐Resolution Portable TDR with Frequency‐Domain Analysis Tools

    Ideal for testing all types of microwave/RF and digital cables and connectors

    • Rugged portable TDR with S‐parameter tools
    • Resolves connector detail (<1 cm)
    • 75 μm (0.003 in.) cursor resolution
    • 16‐bit digital sampling at up to 250 KSPS
    • Stores thousands of TDR traces
    • USB host/client, 10/100 Ethernet
    • Lightweight, bright color screen
    • Internet streaming and remote control

     

  • Simplify Aging Aircraft Wiring Maintenance Using High-Resolution MOHR CT100 Series TDR Cable Analyzers

    • Designed for use with the high-resolution CT100 TDR Cable Tester
    • Ideal for TDR testing MIL-STD-1553B data bus aerospace cable assemblies
    • Detect and localize open, short, and partial cable and connector faults on the main bus and stubs
    • Detects cable and connector faults through 3+ transformer couplers
    • Simplifies troubleshooting of aging aircraft MIL-STD-1553 cable assemblies

     

  • Next-gen Time-Domain Reflectometers replace the Tektronix® 1502C

    The new CT100 and CT100HF are the industry’s highest-resolution portable metallic TDRs, designed for testing all coaxial and twisted-pair cables and interconnects used in modern microwave/RF and digital systems. These are the only portable instruments that exceed all TDR specifications of the Tektronix® 1502C Metallic TDR Cable Tester, while providing next-generation improvements in TDR analysis, data storage, connectivity, and ergonomics.

    CT100 Series TDRs feature 8-10x sharper spatial resolution and100-1000x better Distance-to-Fault (DTF) resolution than competing TDR instruments, and have multi-GHz bandwidth similar to competing FDR (Frequency-Domain Reflectometer) instruments with similar or better cable fault sensitivity andorders-of-magnitude better DTF precision.

    These instruments’ unique combination of fast system rise-time,high-resolution time-base, and precision 16-bit impedance measurements allow you to identify and correct subtle changes in cable and connector performance before system failure. Some of the CT100 Series’ innovative features are described below. Also, please read CT100 Series Features for more information.