Products

Perfectly matched to the |Z| Probe®

The CSR family of calibration substrates delivers the highest accuracy available due to the high quality of each substrate. The calibration standards are manufactured using rugged, hard gold, which ensures a long lifetime.

• SlimVue Microscope
  • Combined eye-pieces and CCD camera mount
  • 3x zoom and quick lens exchange
  • Quick lens exchange
  • 1 um optical resolution
  • Minimized scope footprin
• Application Specific Sigma Kits
  • Optical feedback on platen position (gauge)
  • Adaptable to any mmW/sub-THz applications
  • Seamless integration with any mmW modules and tuners
  • Fast mounting and setup change
• THz measurement capability
  • Rock-solid mechanical design
  • Submicron stage accuracy
  • Optical feedback on platen and probe position (gauge)
  • Motorized positioner

Durable multi-contact wafer probe with controlled impedance power bypass technology

• High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
• RF bandwidth to 500 MHz
• Long probe life: > 250,000 contacts
• Beryllium-copper tips for gold pads or tungsten for aluminum pads
• Oscillation-free testing of wide-bandwidth analog circuits
• Use with ACP series probes to provide functional at-speed testing for known-good-die
• Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
• Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)

• Three Probe Technologies
  • nfinity Probe: best for Al (Si)
  • ACP Probe: best for AU (III-Vs)
  • |Z| Probe: robust solution (long lifetime)
• Precise Contact Solution
  •  Precision probe alignment
  • Consistent contact force and overtravel
  • Stable contact performance
• WinCal XE Calibration Software
  • Exclusive 1-, 2-, 3-, and 4-port on-wafer calibration algorithms
  • Automated calibration monitoring
  • Unique measurement & analysis methods

Multiline TRL Substrates for T-Wave Probes

• Substrate material: High-resistivity silicon
• Substrate thickness: 275 µm
• Dielectric constant: 11.8
• Nominal Z₀: 50 Ω

200 mm semi-/ fully-automated production probe system

• Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
• Faster time to data
• Highest Z-axis resolution of any production prober
• Highest Z-axis resolution of any production prober
• Interfaces to all major analysis instrumentation, optics software and testers
• Backside instrumentation, e.g.: Integrating Sphere, Fiber setup, Pressure Module
• Highly accurate light measurement

Long-lasting, rugged RF and microwave on-wafer probes

• Unique Air Coplanar tip design with choice of beryllium copper (BeCu) or tungsten tip material
• DC to 110 GHz models available in single and dual line versions
• Low insertion and return loss with ultra-low-loss ( -L ) versions
• Excellent crosstalk characteristics
• Wide operating temperature -65 ° C to + 200 ° C
• Wide range of pitches available, from 50 to 1250 µm
• Individually supported contacts
• Reduced contact (RC) probe tips for small pads
• BeCu tip provides rugged, repeatable contact on gold pads

• Flexibility
  • Different substrate carriers for wafers up to 200 mm or single dies
  • Probe cards and/or up to eight positioners
  • Use with liquid nitrogen or helium, depending on the target temperature
• Stability
  • Probe positioners placed inside vacuum chamber
  • Short and stable probe arms
  • Solid station frame with built-in vibration-isolation
  • Optional microscope bridge
  • Precise probe positioning
• Ease of Use
  • Joystick controller
  • Manual probe positioners with rotary feed-throughs
  • Front loading capability through load door
  • Comfortable and easy operation

• Flexibility
  • Different substrate carriers for wafers up to 200 mm or single dies
  • Probe cards and/or up to eight positioners
  • Optional thermal chuck (-60°C to 300°C) and pressure regulation
• Stability
  • Probe positioners placed inside vacuum chamber
  • Short and stable probe arms
  • Solid station frame with built-in vibration-isolation
  • Optional microscope bridge
  • Precise probe positioning
• Ease of Use
  • Joystick controller
  • Manual probe positioners with rotary feed-throughs
  • Front loading capability through load door
• High measurement throughput
  • Software control of chuck for fast step-and-repeat testing of the entire wafer
  • Fast step-and-repeat testing of the whole wafer

• Flexibility
  • Different substrate carriers for wafers up to 200 mm or single dies
  • Probe cards and/or up to eight positioners
  • Optional thermal chuck (-60°C to 300°C) and pressure regulation
• Stability
  • Probe positioners placed inside vacuum chamber
  • Short and stable probe arms
  • Solid station frame with built-in vibration-isolation
  • Optional microscope bridge
  • Precise probe positioning
• Ease of Use
  • Joystick controller
  • Manual probe positioners with rotary feed-throughs
  • Front loading capability through load door
  • Comfortable and easy operation
• High measurement throughput
  • Software control of chuck for fast step-and-repeat testing of the entire wafer
  • Fast step-and-repeat testing of the whole wafer

• Superior Mechanics
  • Highly stable granite base
  • Fast navigation and high-precision probe positioning
• High Flexibility
  • Re-configurable for DC, RF, mmW, FA, WLR and more
  • Full thermal range of -60°C to +300°C
• Ease of Use
  • Low-profile, straightforward design
  • Spacious top chambers for up to 12 positioners
  • Easy and ergonomic operation
• Shielding
  • Reduces electrical noise by providing a fully electromagnetically shielded, ultra-low-noise, light-tight environment
  • Full thermal range of -60°C to +300°C available

• Superior Mechanics
  • Highly stable granite base
  • Excellent measurement accuracy and repeatability
• High Flexibility
  • Re-configurable for DC, RF, mmW, FA, WLR and more
  • 40 mm platen height adjustability
  • Fast transition between wafer and package test
• Ease of use
  •  Low-profile, straightforward design
  • Easy and ergonomic operation
• Double-side option
  • Front or backside probing capability
  • Access to top side and bottom side of device under test (DUT)

• Superior Mechanics
  • Different substrate carriers for wafers up to 200 mm or single dies
  • Probe cards and/or up to eight positioners
  • Use with liquid nitrogen or helium, depending on the target temperature
• Stability
  • Independently cooled cold shield
  • Probe positioners placed inside vacuum chamber
  • Short and stable probe arms
  • Solid station frame with built-in vibration-isolation
  • Optional microscope bridge
  • Optional upgrade for 300 mm wafer
• Ease of Use
  • Intuitive, manual drives
  • Front loading capability through load door
  • Comfortable and easy operation
• High measurement throughput
  • Independent control of linear chuck stage and positioners
  • Contact/separation stroke for chuck
  • Fast, manual step-and-repeat testing of the whole wafer

200 mm semi-/ fully-automated production probe system

• Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
• Faster time to data
• Highest Z-axis resolution of any production prober
• Highest Z-axis resolution of any production prober
• Interfaces to all major analysis instrumentation, optics software and testers
• Backside instrumentation, e.g.: Integrating Sphere, Fiber setup, Pressure Module
• Highly accurate light measurement

with Autonomous Silicon Photonics Measurement Assistant

• Revolutionary technology advancement for wafer and die-level photonics probing
• Enables autonomous measurements
• Highest accuracy in test results
• Reduced risk of damaging fibers with collision avoidance technology
• Easy setup even for less experienced users
• Minimized coupling losses with minimal trench dimensions
• Positioning hardware is precisely calibrated to the probe station and ready to perform die-to-die optical optimizations in minutes
• Other integrated features: Incident Angle Cal, Optical Rotation Scan, Optical Scan Data Analysis, Optical Tracking, Align Optical Probes
• 40°C to +125°C
• Enables hands-free autonomous calibration and re-calibration at multiple temperatures

• Rapid image acquisition
• High resolution imaging
• SQUID sensor autotuning
• Unattended operation
• Sample size
• Closed-loop scanner stage
• Magnetic shielding
• Magnetic field control
• Flexible sensor integration
• Cryogen-free